Engineering Development

The process of inventing and demonstrating this technology has already been carried out in several candidate semiconductor materials, so the remaining development work consists of identifying those specific semiconductor materials and structure configurations that will result in an efficient MicroPower Chip that is also thermally matched to the waste heat market, economical, long-lasting and durable. Fortunately, the structure of the MicroPower Chip is fundamentally economical as it is based on simple structures built on bulk materials which require a limited number of known standard semiconductor manufacturing steps. MicroPower has identified Texas State University in San Marcos as the ideal partner to complete the development work as the appropriate semiconductor processing and expertise compliment is readily available.
 
Two or three material combinations will undergo iterative experimentation to optimize performance, durability and operational life. Each of these features must be resolved by good engineering design and iterative testing.
 
The development plan includes four MicroPower Chips for production - low, medium, and high temperature power mode MicroPower Chips, and a cooling mode MicroPower Chip. The high temperature MicroPower Chip will be prepared for production first as this has the greatest market potential, and will pave the way for quick development of the lower temperature and cooling devices.