Engineering Development


Engineering Dev
The process of inventing and demonstrating this technology has already been carried out, so the remaining development work consists of identifying those materials and structure configurations that will result in an efficient MicroPower Chip that is also economical, long-lasting and durable. Fortunately, the structure of the MicroPower Chip is fundamentally economical as it is based on simple structures in bulk materials which are relatively easy to manufacture.
 
Two or three material combinations will undergo iterative experimentation to optimize performance, durability and operational life. Each of these issues must be solved by good engineering design and iterative testing.
 
It is likely that four MicroPower Chips will be developed for production - low, medium, and high temperature power mode MicroPower Chips, and a cooling mode MicroPower Chip. The high temperature MicroPower Chip will be prepared for production first as this has the greatest market potential, and will pave the way for quick development of the lower temperature and cooling devices.